Flying probe
Flying probe test systems are often used for testing Low to Mid volume production, NPI, prototypes and, boards that present accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access components on printed circuit assemblies (PCAs). Commonly used for test of analog components, analog signature analysis, and short/open circuits. They can be classified as in-circuit test (ICT) systems or as Manufacturing Defects Analyzers (MDAs). They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards. The precision movement can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive fixturing or programming required.
Uses
- 4-wire Kelvin measurements
- Analog component testing
- Analog signature analysis
- ATE diagnostics
- Bare board test
- Boundary scan testing
- Flash programming
- Functional test
- Low Value Component testing
- New Product Introduction
- Open/short detection
- Optical Inspection
- Power-off testing
- Power-on testing
Benefits
- Lower cost than standard "Bed Of Nails" ICT (In-Circuit Test), because no fixturing is required
- Provides access to components that cannot be accessed in an ICT fixture because of the accuracy of the probing techniques
- TTM (Time-To-Market) Fast time to first test, because of fast development cycle
- Increased fault coverage and defect detection over other test techniques
Vendors
Acculogic Inc.(http://acculogic.com/products/flying-probe-testers/)
Digitaltest, Inc. (www.digitaltest.com)
Seica (www.seica.com)
SPEA (www.spea.com)
Takaya (www.takaya.co.jp)