Multi-chip module

A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery).

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).^[1] Other terms, such as "hybrid" or "hybrid integrated circuit", also refer to MCMs.

Overview

Multi-Chip Modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a High Density Interconnection (HDI) substrate.

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. MCMs are classified according to the technology used to create the HDI (High Density Interconnection) substrate.

• MCM-L – laminated MCM. The substrate is a multi-layer laminated PCB (Printed circuit board).
• MCM-D – deposited MCM. The modules are deposited on the base substrate using thin film technology.
• MCM-C – ceramic substrate MCMs, such as LTCC.

Chip stack MCMs

A relatively new development in MCM technology is the so-called "chip-stack" package.^[2] Certain ICs, memories in particular, have very similar or identical pinouts when used multiple times within systems. A carefully designed substrate can allow these dies to be stacked in a vertical configuration making the resultant MCM's footprint much smaller (albeit at the cost of a thicker or taller chip). Since area is more often at a premium in miniature electronics designs, the chip-stack is an attractive option in many applications such as cell phones and personal digital assistants (PDAs). After a thinning process, as many as ten dies can be stacked to create a high capacity SD memory card.^[3]

Examples of MCM technologies

• IBM Bubble memory MCMs (1970s)
• IBM 3081 mainframe's thermal conduction module (1980s)
• Intel Pentium Pro, Pentium D Presler , Xeon Dempsey and Clovertown, Core 2 Quad (Kentsfield and Yorkfield), Clarkdale, Arrandale, and Haswell-H
• Sony memory sticks
• Xenos, a GPU designed by ATI Technologies for the Xbox 360, with eDRAM
• POWER2, POWER4, POWER5 and POWER7 from IBM
• z196 from IBM
• AMD processors for Socket G34
• Nintendo's Wii U has its CPU, GPU, and onboard VRAM (integrated into the GPU) on one MCM.^[4]
• VIA Nano
• Flash and RAM memory combined on a PoP by Micron

See also

• System in package (SIP)
• Hybrid integrated circuit
• Chip carrier Chip packaging and package types list

References

1. Rao Tummala, Solid State Technology. “SoC vs. MCM vs SiP vs. SoP.” Retrieved August 4, 2015.
2. Jon Worrel (15 April 2012). "Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell". Fudzilla.
3. Richard Chirgwin, The Register. “Memory vendors pile on '3D' stacking standard.” April 2, 2013. February 5, 2016.
4. Satoru Iwata, Iwata Asks. “Changes in Television.” Retrieved August 4, 2015.

External links

• Multichip Module Technology (MCM) or System on a Package (SoP)
• AMD aims to stay in the race with Magny-Cours 12-core CPU
• MCM Design in AutoCAD – CDS Master MCM Designer Suite